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Dow and Fuji Xerox Join Eco-patents Commons, Xerox Pledges Additional Patent to Help the Planet
Geneva, 20 October 2009 - The Dow Chemical Company (Dow) and Fuji Xerox Co., Ltd. (Fuji Xerox), a joint venture between Xerox Corporation and FUJIFILM Holdings Corporation, have joined the Eco-Patent Commons, a first-of-a-kind business effort coordinated by the World Business Council for Sustainable Development (WBCSD) to help the environment by pledging environmentally beneficial patents to the public domain. |
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Ricoh and Taisei Join Eco-Patent Commons, DuPont Contributes Additional Eco-friendly Patents
Geneva, 23 March 2009 - Ricoh Company, Ltd., a global leader in office solutions, and Taisei Corporation, a leading engineering construction company, have joined the Eco-Patent Commons, a first-of-a-kind business effort coordinated by the World Business Council for Sustainable Development (WBCSD) to help the environment by pledging environmentally beneficial patents to the public domain. |
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The Eco-Patent Commons, launched by IBM, Nokia, Pitney Bowes and Sony in partnership with the WBCSD, was founded on the commitment that anyone who wants to bring environmental benefits to market can use these patents to protect the environment and enable collaboration between businesses that foster new innovations. The objectives of the Eco-Patent Commons are :
- To provide an avenue by which innovations and solutions may be easily shared to accelerate and facilitate implementation to protect the environment and perhaps lead to further innovation.
- To promote and encourage cooperation and collaboration between businesses that pledge patents and potential users to foster further joint innovations and the advancement and development of solutions that benefit the environment.
Since the launch of the Eco-Patent Commons in January 2008, one hundred eco-friendly patents have been pledged by eleven companies representing a variety of industries worldwide: Bosch, Dow, DuPont, Fuji-Xerox, IBM, Nokia, Pitney Bowes, Ricoh, Sony, Taisei and Xerox.
Overview
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